Beckhoff at interpack 2023
Automation solutions for sustainable packaging
Headquarters Singapore
Beckhoff Automation Pte. Ltd.
Automation solutions for sustainable packaging
The packaging industry needs to find future-proof answers to existential challenges now more than ever before: How can we increase the number of products being packaged in a way that saves resources and energy? Beckhoff will demonstrate how innovative automation technology solves these issues at interpack 2023 in Düsseldorf from May 4 to 10: our intelligent transport systems, combined with our Vision system and high-performance drive solutions, build the backbone of efficient packaging processes.
Are you thinking about replacing control cabinets entirely to save time in engineering and valuable floor space at the plant? We also provide custom solutions for control cabinet-free automation with the modular MX-System. Discover our comprehensive portfolio at interpack. See how our solutions are the perfect fit for your packaging machinery.
We look forward to seeing you in Hall 13, Booth B75.
XPlanar: Levitating, contactless, intelligent
XTS: For innovative machine concepts
Hülshorstweg 20
33415 Verl
Germany
+49 5246 963-0
info@beckhoff.com
www.beckhoff.com/en-en/